DENSE,
TWO-DIMENSIONAL OPTOELecTRONIC CHIPS FOR HIGH-SPEED, PARALLEL OPTICAL LINKS
Doug J. Burrows,
Kelly A. Zabierek, Richard R. Dennis,
Suzanne M. Wade, and
Robert W. Cook
TeraConnect, Inc.,
dburrows@teraconnect.com
(603) 885-1094
Keywords: Parallel optics, VCSELs, transmit modules, receive
modules, hybrid opto-electronic chips
Abstract:
Two-dimensional
opto-electronic chips are gaining acceptance as a means to dramatically
increase data transfer bandwidths. Thermal issues combine with the laws of
statistics to stand in the way of achieving the low failure rates demanded by
system engineers. Redundancy constitutes a promising avenue to pursue for
circumventing the problem and ensuring the desired component life expectancies.